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hH Optical Reflective Sensors Technical Data
HBCC-1570 HBCC-1580 HBCC-1590
Features
*
Description
* * * *
The HBCC-15XX series sensors Focused Emitter and are fully integrated modules Detector in a Single designed for applications requirPackage ing optical reflective sensing. The TO-5 Miniature Sealed modules contain a 655 nm (or 820 Package nm) LED emitter and a photoPhotodiode Output diode. A bifurcated aspheric lens Choice of Resolutions is used to image the active areas (0.13 mm, 0.178 mm, 0.33 mm) of the emitter and detector to a single spot 4.27 mm (0.168 in.) in Two Wavelengths front of the package. The output Available; 655 nm, 820 nm signal is a current generated by (see selection guide) the photodiode.
Applications
The HBCC-15XX sensors are intended for use with the HewlettPackard HBCC-0500 and HBCC0600 low current digitizer ICs, or
Selection Guide
Sensor Part Number LED Resolution LED Wavelength HBCC-1570 0.33 mm (0.013 in.) 655 nm HBCC-1580 0.185 mm (0.007 in.) 655 nm
9.40 (0.370) 8.51 (0.335) 5.08 (0.200)
HBCC-1590 0.13 mm (0.005 in.) 820 nm
Package Dimensions
MAXIMUM SIGNAL POINT - MSP REFERENCE PLANE
S.P.
R.P. 12.0 (0.473) O.D. 8.33 (0.328) 8.12 (0.320)
C L 1.14 (0.045) 0.73 (0.029) Z 0.86 (0.034) 0.73 (0.029)
NOTES: A. ALL DIMENSIONS IN MILLIMETERS AND (INCHES). B. ALL UNTOLERANCED DIMENSIONS ARE FOR REFERENCE ONLY. C. THE REFERENCE PLANE (R.P.) IS THE TOP SURFACE OF THE PACKAGE. D. NICKEL CAN AND GOLD PLATED LEADS. E. S.P. = SEATING PLANE. F. THE LEAD DIAMETER IS 0.45 mm (0.018 in.) TYP. G. O.D. = OUTSIDE DIAMETER OF CAN MEASURED IN REGION ABOVE WELD FLANGE TO MIDWAY OF CAN LENGTH.
5.08 (0.200)
4.27 0.25 (0.168) (0.010)
15.24 (0.600) 12.70 (0.500)
11.50 (0.453) 11.22 (0.442)
5965-5942E
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with suitable PCB assemblies provided by HP for use with these sensors. The HBCC-15XX sensors have been characterized for use only with Hewlett-Packard's digitizer IC technology. Use of these sensors in designs or applications other than those stated is at the customer's risk.
HBCC-1570, 1580 Optical System
EMITTER BAFFLE EPOXY SEAL
Mechanical Considerations
The HBCC-15XX series are packaged in a high profile 8 pin TO-5 metal can with a glass window. The LED and photodiode are mounted on a header at the base of the package. Positioned above these active elements is a bifurcated aspheric acrylic lens that focuses them to the same point. The sensor can be rigidly secured by commercially available TO-5 style heat sinks or 8 pin 0.200 inch diameter pin circle sockets. These fixtures provide a stable reference platform for affixing the HBCC15XX sensors to a circuit board. In applications requiring contact scanning (such as bar code reading), protective focusing tips are available. Focusing tips are available in either metal or polycarbonate packages using a sapphire ball as the contact surface. The Hewlett-Packard part numbers are HBCS-2999, HBCS4999, HBCS-A998, and HBCS-A999.
GLASS LENS DETECTOR
SENSING AREA
HBCC-1590 Optical System
SILICON BAFFLE EMITTER 0.089 mm DIA. JUNCTION OPTICAL APERTURE BAFFLE
EPOXY SEAL
SENSING AREA
GLASS LENS
DETECTOR 0.406 mm SQUARE
Electrical Operation
The sensor detector is a pn photodiode. The LED cathode is physically and electrically connected to the case-substrate of the sensor. The HBCC-15XX sensors are characterized for use with HewlettPackard's low current digitizer ICs. The digitizer IC part numbers are HBCC-0500 and HBCC-0600. Data Sheets including circuit diagrams are available.
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Absolute Maximum Ratings
TA = 25C unless specified otherwise (unless specified separately, data applies to all sensors)
Parameter Storage Temperature Operating Temperature Lead Soldering Temperature (1.6 mm from Seating Plane) Average LED Forward Current Peak LED Forward Current If Ifp 125 100 40 5.0 2.5 -0.3 6.0 mA mA mA V V V Symbol TS TA Min. -40 -20 Max. +75 +75 260 (for 10 seconds) Units C C C 1 2 3 (HBCC-1570) 3 (HBCC-1580) 4 (HBCC-1590) HBCC-1590 Only 5 Notes
Reverse LED Input Voltage Photodiode Bias
Vr Vd
Notes: 1. CAUTION: The thermal constraints of the acrylic lens will not permit conventional wave soldering procedures. The typical preheat and post-soldering cleaning procedures and dwell times can subject lens to thermal stresses beyond the absolute maximum ratings and can cause it to defocus. 2. These sensors are specified for use with the drive conditions provided by the HBCC-0500 and HBCC-0600 Digitizer IC ONLY. 3. When used with HBCC-0500 or HBCC-0600 digitizer ICs. 4. At all combinations of pulse width and duty cycle. 5. Voltage differential between Pin 1 and Pin 8 with Pin 8 taken as reference. Exceeding maximum conditions may cause permanent damage to photodiode or to chip metallization.
REFLECTOR REFERENCE PLANE 8 Z 1 D ps Rs + LED 3 4 CASE, SUBSTRATE TOP VIEW Rs = CHARACTERISTIC NOT DEFINED SCHEMATIC DIAGRAM CONNECTION DIAGRAM 5 7 PIN# 1 2 6 6 8 2 6 LED D ps Rs 1 8 FUNCTION PHOTODIODE CATHODE HEADER GROUND LED ANODE PHOTODIODE ANODE
2
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HBCC-1570 and HBCC-1580: Electrical and Optical Characteristics
TA = 25C
Parameter Reflected Photocurrent Quality Factor Maximum Signal Point (MSP) LED Forward Voltage LED Reverse Breakdown Voltage Photodiode Dark Current Photodiode Capacitance LED Peak Wavelength Ipr Temperature Coefficient System Optical Step Response (OSR) HBCC-1570 (OSR) HBCC-1580 Symbol Ipr Z Vf BVR Id Cd Ke d 0.82 4.11 (0.162) 1.5 5.0 - - - - - Min. Typ. (see Bin Table) 0.95 4.27 (0.168) 1.75 - 60 100 60 650 -0.006 0.268 (0.0106) 1.0 4.42 (0.174) 2.0 - 1000 - - 670 - - Max. Units nA - mm (in.) V V pA pF pF nm 1/C mm (in.) Conditions If = 70 mA peak If = 70 mA peak If = 70 mA peak If = 70 mA Ir = 100 A Vd = 5 V Vd = 0 V Vd = 1 V If = 35 mA DC If = 35 mA DC 4.27 mm (Target from sensor) 4.27 mm (Target from sensor) 10 11 7A Note 6,7 6,8 6,9 1, 4A, 4B 3 Figure 1,2A, 4A, 4B, 5
6A
d
-
0.154 (0.0061)
-
mm (in.)
11
7B
Notes: 6. Measured from a reflector coated with 99% diffuse reflective white paint (Kodak 6080) positioned 4.27 mm (0.168 in.) from the reference plane. Measured physically is the total photocurrent, Ipt, which consists of a signal (reflected from target) component, Ipr, and a component induced by reflections internal to the sensor (stray), Ips. Ipt = Ipr + Ips. Specified is the reflected signal component, Ipr. 7. See Bin Table 8. = Ipr/Ipt 9. Measured from reference plane (R.P.) of sensor. 10. Photocurrent variation with temperature varies with LED output which follows a natural exponential law: Ip(T) = Ip(To)*exp[Ke(T-To)] 11. OSR is defined as the distance for a 10%-90% "step" response of Ipr as the sensor moves over an abrupt black-white edge, or from opaque white to free space (no reflection).
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HBCC-1590: Electrical and Optical Characteristics
TA = 25C
Parameter Reflected Photocurrent Quality Factor Maximum Signal Point (MSP) LED Forward Voltage LED Reverse Breakdown Voltage Photodiode Dark Current Photodiode Capacitance LED Peak Wavelength Ipr Temperature Coefficient System Optical Step Response (OSR) Symbol Ipr Z Vf BVR Id Cd Ke d Min. Typ. Max. Units nA 1.0 4.62 (0.182) 1.8 - 1000 - 835 - - - - mm (in.) V V pA pF pF nm 1/C mm (in.) Conditions If = 30 mA peak If = 30 mA peak If = 30 mA peak If = 30 mA Ir = 100 A Vd = 5 V Vd = 0 V Vd = 1 V If = 35 mA DC If = 35 mA DC 4.27 mm (Target from sensor) 10 11 7C 6B Note 6,7 6,8 6,9 1, 4C 3 Figure 1,2B, 4C, 5
(see Bin Table) 0.82 4.01 (0.158) 1.3 2.5 - - 805 - - - 0.95 4.27 (0.168) 1.45 - 60 100 60 820 -0.005 0.140 (0.0055)
REFLECTOR REFERENCE PLANE
Z
+Vf 6 If Rs 2 CASE, SUBSTRATE LED D ps 8 1
Ipt nA-METER
Figure 1. Photocurrent Test Circuit.
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Bin Table
Ipr Limits (nA) Bin# 1 2 3 4 5 6 Min. 160 215 255 300 360 430 Max. 225 270 313 375 440 555
conditions and temperature. LED degradation is minimized by the drive conditions generated by both the HBCC-0500 and HBCC-0600, (when used as specified).
Warranty and Service
HP Optical Reflective Sensors are warranted for a period of one year after purchase covering defects in material and workmanship. Hewlett-Packard will repair or, at its option, replace products that prove to be defective in material or workmanship under proper use during the warranty period. NO OTHER WARRANTIES ARE EXPRESSED OR IMPLIED, INCLUDING BUT NOT LIMITED TO THE IMPLIED WARRANTIES OF MERCHANT ABILITY AND FITNESS FOR A PARTICULAR PURPOSE. HEWLETT-PACKARD IS NOT LIABLE FOR CONSEQUENTIAL DAMAGES. For additional warranty or service information please contact your local Hewlett-Packard sales representative or authorized distributor.
Product Marking
The photocurrent binning of the sensor is incorporated as part of the product marking format. The Bin # is represented as the last number (N) on the last line of marking. HP HBCC-15XX XXXXXXXN N = bin number
Bin Availability
The entire available distribution of parts, appropriately marked, will be shipped. Requests for individual bin selections cannot be honored.
Binning and Temperature Effects
Test algorithm bins units to the lower bin number if a unit is in the bin overlap region. Such units can cross bin boundaries as temperature changes. (Ambient temperature affects LED efficiency slightly and may cause several percentage changes in Ipr.) Bin numbers are for "reference only" and do not constitute an absolute guarantee. The output of all LEDs degrades with time, depending on drive
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1.6
1.4
PHOTOCURRENT NORMALIZED AT If - 30mA, 25C
2.0 1.8
Vf - FORWARD VOLTAGE, V
PHOTOCURRENT NORMALIZED AT If - 70mA, 25C
1.4 1.2 1.0 0.8 0.6 0.4 HBCC-1570 0.2 0 0 10 20 30 40 50 60 70 80 90 100 If - FORWARD LED CURRENT, mA
1.2 1.0 0.8 0.6 0.4 0.2 0
1.6 HBCC-1580 1.4 HBCC-1570 1.2 1.0 HBCC-1590 0.8
HBCC-1580
0
10 20 30 If - FORWARD LED CURRENT, mA
40
0.6 0.001
1 0.1 0.01 10 If - FORWARD CURRENT, mA
100
Figure 2A. Typical Reflected Photocurrent.
Figure 2B. Typical HBCC-1590 Reflected Photocurrent.
Figure 3. Typical LED Forward Voltage vs. Forward Current.
100 MIN MSP PERCENT MSP SIGNAL 80
MEAN MSP MAX MSP
100 MIN MSP
PERCENT MSP SIGNAL
100
MEAN MSP MIN MSP MAX MSP
MEAN MSP
80
PERCENT MSP SIGNAL
MAX MSP
80
60
60
60
40
40
40
20
20
20
0
3.0
4.0 5.5 3.5 5.0 4.5 DISTANCE FROM SENSOR, mm
0
3.0
4.0 5.5 3.5 5.0 4.5 DISTANCE FROM SENSOR, mm
0
3.0
4.0 5.5 3.5 5.0 4.5 DISTANCE FROM SENSOR, mm
Figure 4A. HBCC-1570 Signal vs. Distance from Sensor.
Figure 4B. HBCC-1580 Signal vs. Distance from Sensor.
Figure 4C. HBCC-1590 Signal vs. Distance from Sensor.
LIGHT OUTPUT, NORMALIZED TO 25C VALUE
RESPONSE AT GIVEN WAVELENGTH NORMALIZED TO PEAK
HBCC 1570 HBCC 1580 0.8
-20C 1.50 1.25 1.00 25C 0.75 70C 0.50 0.25 0 0C
LIGHT OUTPUT, NORMALIZED TO 25C VALUE
1.0
1.75
1.4 -40C 1.2 1.0 25C 0.8 85C 0.6 0.4 0.2 0
0.6
TYP. PEAK RESPONSIVITY Po =0.34 AMPS/WATT
0.4 HBCC 1590 0.2 LOW-PASS FILTERING OF AMBIENT LIGHT CAUSED BY RED LENS 500 550 600 650 700 750 800 WAVELENGTH, nm 850 900
0
600
620
660 640 WAVELENGTH, nm
680
700
740
780
820 860 WAVELENGTH, nm
900
Figure 5. Relative Spectral Response of Sensors.
Figure 6A. Typical Spectral Distribution of 655 nm LED.
Figure 6B. Typical Spectral Distribution of 820 nm LED.
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1.0 100% 90% WHITE
Preferred Orientation
NON-PREFERRED ORIENTATION
NORMALIZED SIGNAL
d -- SYSTEM RESPONSE -- mm
0.8
d
0.6
10% 0
BLACK
0.4
0.2
PREFERRED ORIENTATION 0 3.0 3.5 4.0 4.5 DISTANCE FROM SENSOR -- mm 5.0 5.5
At maximum signal point (MSP) when the sensor is in focus, the orientation of the sensor is unimportant. However, as one moves away from MSP (either by distance or angle), the preferred orientation indicated above is recommended to maintain a higher resolution spot size.
Figure 7A. HBCC-1570, System Optical Step Response Variation with Distance.
1.0
NORMALIZED SIGNAL
100% 90%
WHITE
d -- SYSTEM RESPONSE -- mm
0.8
d
0.6
10% 0
BLACK
NON-PREFERRED ORIENTATION 0.4
0.2
PREFERRED ORIENTATION 0 3.0 3.5 4.0 4.5 DISTANCE FROM SENSOR -- mm 5.0 5.5
Figure 7B. HBCC-1580, System Optical Step Response Variation with Distance.
1.0 WHITE
d -- SYSTEM RESPONSE -- mm
0.8
NORMALIZED SIGNAL
100% 90%
d
0.6
PREFERRED ORIENTATION
10% 0
BLACK
0.4
0.2 NON-PREFERRED ORIENTATION 0 3.0 3.5
4.0 4.5 DISTANCE FROM SENSOR -- mm
5.0
5.5
Figure 7C. HBCC-1590, System Optical Step Response Variation with Distance.
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